芯       片：
平膜/隔膜感壓防堵結構設計，適用于熔體/流體介質；
采用進口感壓芯片；選進的貼片工藝；
高阻抗、高精度、高穩(wěn)定性；
膜片結構：厚膜型壓阻式、溥膜型硅芯片、法蘭型大膜片；
100萬次使用壽命以上；

信號處理及輸出：
24位ADC采樣處理芯片；
DSP數(shù)字信號調理算法；
多點性線溫度校準；
電壓電流過載保護；
四位顯示壓力表頭；
顯示范圍：-1999-9999；
采樣速率：10次/S；
標準4-20mA二線制電流環(huán)輸出信號；

結       構：
厚膜結構：深度氬弧焊接，連接彈性材料與過程接頭，強度高，抗沖擊，耐疲勞；
溥膜結構：激光焊接，連接彈性材料與過程接頭，硅油介質傳遞壓力，響應快，耐疲勞，小量程；
DIN43650赫斯曼標準電氣連接器；
配套標準四芯屏蔽電纜；
整體結構小巧，過程連接方式多樣化（M20X1.5,G1/2 ,ZG1/2,1/2NPT(螺紋小徑≥17mm)DN50等）；
過程連接材料：304或316；

應      用：
熔體/流體/粘稠性介質壓力測量與控制；
工業(yè)/電力/石油/自動化等領域的設備壓力測量


Chip:
Flat film / diaphragm pressure sensing and anti blocking structure design, suitable for melt / fluid medium;
Adopt imported pressure sensitive chip; select the chip technology;
High impedance, high precision and high stability;
Diaphragm structure: thick film piezoresistive, thin film silicon chip, flange type large diaphragm;
More than 1 million service life;

Signal processing and output:
24 bit ADC sampling processing chip;
DSP digital signal conditioning algorithm;
Multipoint line temperature calibration;
Voltage and current overload protection;
Four position pressure indicator;
Display range: - 1999-9999;
Sampling rate: 10 times / S;
Standard 4-20mA two-wire current loop output signal;

Structure:
Thick film structure: deep argon arc welding, connecting elastic material and process joint, high strength, impact resistance, fatigue resistance;
Thin film structure: laser welding, connecting elastic materials and process joints, silicon oil medium transfer pressure, fast response, fatigue resistance, small range;
Din43650 Hersman standard electrical connector;
Supporting standard four core shielded cable;
The overall structure is small and the process connection mode is diversified (m20x1.5, G1 / 2, ZG1 / 2, 1 / 2NPT (thread diameter ≥ 17mm) DN50, etc.);
Process connection material: 304 or 316;

Application:
Melt / fluid / viscous medium pressure measurement and control;
Equipment pressure measurement in industry / power / oil / automation and other fields

四、電氣連接