產(chǎn)品優(yōu)勢： 
芯 片：
平膜/隔膜感壓防堵結(jié)構(gòu)設(shè)計，適用于熔體/流體介質(zhì)；
采用進口感壓芯片；選進的貼片工藝；
高阻抗、高精度、高穩(wěn)定性；
膜片結(jié)構(gòu)：厚膜型壓阻式、溥膜型硅芯片、法蘭型大膜片；
100萬次使用壽命以上；
信號處理及輸出：
24位ADC采樣處理芯片；
DSP數(shù)字信號調(diào)理算法；
多點性線溫度校準(zhǔn)；
電壓電流過載保護；
標(biāo)準(zhǔn)工業(yè)信號輸出：4-20mA(二線制)，0-20mA(三線制)，0-5VDC，0-10VDC，0.5-4.5VDC(三線制);
數(shù)字通訊信號輸出：RS485-RTU、超低功耗RS485-RTU
采用的32bit微處理器和24bit ADC
傳輸協(xié)議采用通用的MODBUS-RTU協(xié)議
支持波特率：1200~57600bps，校驗位：NONE、ODD、EVEN
支持用戶二次校準(zhǔn)、清零、反清零、恢復(fù)出廠等操作
支持11種單位切換，支持浮點型、整型、百分比、格式化輸出
采集間隔0~43200秒(12小時)可設(shè)，既可連續(xù)采集，滿足高速采集的場合，也可單次觸發(fā)采集，限度降低功耗
結(jié) 構(gòu)：
厚膜結(jié)構(gòu)：深度氬弧焊接，連接彈性材料與過程接頭，強度高，抗沖擊，耐疲勞；
溥膜結(jié)構(gòu)：激光焊接，連接彈性材料與過程接頭，硅油介質(zhì)傳遞壓力，響應(yīng)快，耐疲勞，小量程；
整體結(jié)構(gòu)小巧，過程連接方式多樣化（M20X1.5,G1/2 ,ZG1/2,1/2NPT(螺紋小徑≥17mm)DN50等）；
過程連接材料：304或316；
應(yīng) 用：
熔體/流體/粘稠性介質(zhì)壓力測量與控制；
工業(yè)/電力/石油/自動化等領(lǐng)域的設(shè)備壓力測量
Chip:
Flat film / diaphragm pressure sensing and anti blocking structure design, suitable for melt / fluid medium;
Adopt imported pressure sensitive chip; select the chip technology;
High impedance, high precision and high stability;
Diaphragm structure: thick film piezoresistive, thin film silicon chip, flange type large diaphragm;
More than 1 million service life;
Signal processing and output:
24 bit ADC sampling processing chip;
DSP digital signal conditioning algorithm;
Multipoint line temperature calibration;
Voltage and current overload protection;
Standard industrial signal output: 4-20mA (two-wire system), 0-20mA (three wire system), 0-5vdc, 0-10vdc, 0.5-4.5vdc (three wire system);
Digital communication signal output: rs485-rtu, ultra-low power rs485-rtu
Advanced 32bit microprocessor and 24bit ADC
The transmission protocol adopts the general MODBUS-RTU protocol
Support baud rate: 1200 ~ 57600bps, check bit: , odd, even
It supports the user's secondary calibration, clearing, anti clearing, factory restoration and other operations
Supports 11 unit switches, floating point, integer, percentage, format output
The acquisition interval of 0-43200 seconds (12 hours) can be set, which can not only continuously acquire, but also meet the occasion of high-speed acquisition, and can trigger acquisition once, minimizing power consumption
Structure:
Thick film structure: deep argon arc welding, connecting elastic material and process joint, high strength, impact resistance, fatigue resistance;
Thin film structure: laser welding, connecting elastic materials and process joints, silicon oil medium transfer pressure, fast response, fatigue resistance, small range;
The overall structure is small and the process connection mode is diversified (m20x1.5, G1 / 2, ZG1 / 2, 1 / 2NPT (thread diameter ≥ 17mm) DN50, etc.);
Process connection material: 304 or 316;
Application:
Melt / fluid / viscous medium pressure measurement and control;
Equipment pressure measurement in industry / power / oil / automation and other fields
